The 3rd Smart Laser Processing Conference 2018(SLPC2018)

Program

April 24 Tue.

SLPC1: SLPC 2018 Plenary Talks
Chairs: Reinhart Poprawe(Fraunhofer Institute for Laser Technology, Germany)

Room 414+417

Start End Session No. Title Speaker Description
9:00 9:10 SLPC 2018
Opening Remark
Masahiro Tsukamoto
JWRI, Osaka University, Japan
Laser pulses are a versatile tool in microelectronics and recently have become attractive in flexible electronics. New processes have been developed to selectively ablate or modify the thin films used in this application area.
9:10 9:50 SLPC1-1Plenary Laser processing in flexible electronics Andreas Ostendorf, Maren Kasischke
Applied Laser Technologies, Ruhr-University Bochum, Germany
Laser pulses are a versatile tool in microelectronics and recently have become attractive in flexible electronics. New processes have been developed to selectively ablate or modify the thin films used in this application area.
9:50 10:30 SLPC1-2Plenary Blue diode laser development for advanced materials processing Masahiro Tsukamoto
Joining and Welding Research Institute, Osaka University, Japan
We have developed a high power blue diode laser with the wavelength of 450 nm. Output power of the laser was 100W. The laser was installed in a 3D printing system based on selective laser melting.
10:30 11:00 Break

SLPC2: Digital Production (AM and IoT) I
Chairs: Masahiro Tsukamoto(JWRI, Osaka University, Japan)
Masahito Katto(University of Miyazaki, Japan)

Room 414+417

Start End Session No. Title Speaker Description
11:00 11:30 SLPC2-1Invited Latest trends of IoT and additive laser manufacturing Bastian Becker1, Antonio Candel-Ruiz1, Stephan Manz1, Dirk Wagner2
1Sales Services, Lasertechnology, TRUMPF Laser- und Systemtechnik GmbH, Germany,
2TRUMPF Laser GmbH, Germany
Internet of Things and Industry 4.0 are common words in today’s industry. Connecting and getting data and information out of machines and lasers. Making data transparent for analysis, resulting in measures to increase productivity and availability of the production.
11:30 12:00 SLPC2-2Invited Toward cool laser manufacturing Yohei Kobayashi, Shuntaro Tani
The University of Tokyo, Japan
The laser manufacturing is getting more and more important to realize a smart society. Here we discuss how to make an automatic system to optimize a parameters of the laser machining.
12:00 13:30 Break

SLPC3: Digital Production (AM and IoT) II
Chairs: Bastian Becker(TRUMPF Laser- und Systemtechnik GmbH, Germany)
Hitoshi Nakano(Kindai University, Japan)

Room 414+417

Start End Session No. Title Speaker Description
13:30 13:45 SLPC3-1 Development of sputter-free selective laser melting for titanium plate fabrication Yuji Sato1, Masahiro Tsukamoto1, Takahisa Shobu2, Takaya Nishi3, Yorihiro Yamashita4, Ritsuko Higashino1, Hitoshi Nakano3, Nobuyuki Abe1
1JWRI, Osaka University, Japan,
2Japan atomic energy agency, Japan,
3Graduate School of Science and Engineering, Kindai University, Japan,
4Industrial Research Institute of Ishikawa, Japan
Titanium plates were fabricated by SLM in vacuum owing to reduce of amount of sputter generation. It was found that the sputtering was inhibited when the T the base plate temperature was raised.
13:45 14:00 SLPC3-2 Development of selective laser melting system applied to fabricate controllable thin-walled metal microstructures Chung-Wei Cheng1, Siang-Yang Wu1, Mi-Ching Tsai2
1Department of Mechanical Engineering, National Chiao Tung University, Taiwan,
2Department of Mechanical Engineering, National Cheng Kung University, Taiwan
This study developed a laboratory selective laser melting (SLM) system, presented thin-walled metal microstructures from maraging steel powders with different geometric shapes by sequentially layering different single laser melted tracks in a vertical direction.
14:00 14:15 SLPC3-3 Advanced beam diagnostics for additive manufacturing laser scanner systems Andreas Koglbauer, Stefan Wolf, Otto Märten, Reinhard Kramer
Research & Development, PRIMES GmbH, Germany
Via a novel beam diagnostic approach for 3D scanners, we are able to determine not only the beam width, but reconstruct the scanned path (orientation, position, and length) of the laser in the measurement plane.
14:15 14:30 SLPC3-4 Effect of laser power on molten pool track and microstructure in laser metal deposition of 316L stainless steel Manjaiah Mallaiah, Jean Yves Hascoet, Matthieu Rauch
Department of Mechanics, Materials and Civil Engineering, Centrale Nantes, France
This paper presents the grain structures, solidification tracks and micro-hardness evolution of 316L stainless steel material after melt depositions at different laser powers.
14:30 14:45 SLPC3-5 The in situ laser-induced synthesis of nickel-gold microstructures for non-enzymatic sensing of glucose Ilya I Tumkin, Evgeniia M Khairullina, Ilia A Aliabev, Vladimir A Kochemirovsky, Maxim S Panov
Institute Chemistry, Saint Petersburg State University, Russia
In the current work the conductive bimetallic microstructures based on nickel and gold with high sensor activity towards glucose were synthesized using the in situ laser-induced metal deposition technique (LCLD)
14:45 15:00 SLPC3-6 Development of non-molten pool type laser coating Yorihiro Yamashita1, Yoshinori Funada1, Masahiro Tsukamoto2, Nobuyuki Abe2, Yuji Sato2, Yuu Sakon3, Kazuki Makinoshima3
1Machinery and Metal, Industrial Research Institute of Ishikawa, Japan,
2Laser Process, Joining and Welding Research Institute, Osaka University, Japan,
3Development Section, Muratani Machine Inc, Japan
Developed non-molten pool type laser coating process is possible to form a thin layer without dilution and shape distortion. Testing using Ni-based SFA powder showed that it is possible for a thickness of only 0.1mm.
15:00 15:15 Break

SLPC4: Advanced Laser and Industrial Applications
Chairs: Beat Neuenschwander(Bern Uniuversity of Applied Sceinces / Institute for Applied Laser, Photonics and Surface technologies ALPS, Switzerland)
Yoshio Hayasaki(Ustunomiya University, Japan)

Room 414+417

Start End Session No. Title Speaker Description
15:15 15:45 SLPC4-1Invited Latest diode laser technology and its industrial applications Markus A. Ruetering, Christoph Ullmann, Matthias Weinbach
Laserline GmbH, Germany
The paper will review the actual industrial applications with diode lasers as well as the new approach with 450 nm blue radiation
15:45 16:00 SLPC4-2 Development of high-energy-class laser processing technologies using a laser-diode pumped 100-J pulse-shaped laser system Yoshio Mizuta, Takashi Kurita, Takeshi Watari, Yuki Kabeya, Takashi Sekine, Yoshinori Tamaoki, Koichi Iyama, Yasuki Takeuchi, Takaaki Morita, Masateru Kurata, Yuma Hatano, Kazuki Kawai, Yuki Muramatsu, Takuto Iguchi, Yoshinori Kato
Central Research Laboratory Industrial development Center Power Laser Development Group, HAMAMATSU PHOTONICS K.K., Japan
We have started to develop a laser-diode pumped cryogenically-cooled Yb:YAG laser system capable of generating 100-J pulse energy combined with a material processing system.
16:00 16:15 SLPC4-3 Micromachining advances with hybrid fiber lasers Rajesh S Patel1, James Bovatsek1, Herman Chui2
1Applications Engineering, Spectra-Physics, USA,
2Product Marketing, Spectra-Physics, USA
A new class of hybrid fiber lasers created by combining fiber and diode pumped solid state laser technologies can deliver both high machining quality and throughput
16:15 16:30 SLPC4-4 Silicon carbide and gallium nitride wafer dicing technique Egidijus Vanagas, Dziugas Kimbaras, Aivaras Kazakevicius, Karolis Zilvinas Bazilevicius
Evana Technologies, UAB, Lithuania
Effective and rapid laser dicing technique for semiconductor devices formed on SiC and GaN substrates with a one pass process. The technique, where thermal stress is induced by delivering at least two ultra-short pulsed-beams.
16:30 16:45 SLPC4-5 Layer accurate controlled laser ablation of CFRP using optical distance measurement Daniel Holder, Rudolf Weber, Thomas Graf
Institut für Strahlwerkzeuge (IFSW), University of Stuttgart, Germany
Optical distance measurement was used to enable controlled and layer accurate laser ablation of CFRP. The reconstructed surface topography by the distance measurement allowed the determination of the fiber direction with an accuracy less than ±5°.
16:45 17:00 SLPC4-6 Heat acumulation controlled surface structuring of stainless steel Sebastian Faas1, Corrado Sciancalepore2, Rudolf Weber1, Luca Romoli3, Thomas Graf1
1IFSW, University of Stuttgart, Germany,
2National Interuniversity Consortium of Materials Science, INSTM-Research Unit of Parma, Italy,
3Department of Engineering and Architecture, University of Parma, Italy
Stainless steel 316L was structured using the mJ-ps-laser of the IFSW. Structuring rates of up to 500 mm²/s were achieved. A novel simple analytical model was used to calculate the deposited heat during processing.
April 25 Wed.

Joint Session: LIC+PLD+SLPC Joint Session 1
Chairs: Kunihiko Washio(Paradime Research, Japan)
Takahisa Jitsuno(Osaka University, Japan)
Takunori Taira(Inst. material Science, Japan)

Room 302

Start End Session No. Title Speaker Description
13:30 13:45 Opening Remarks Masahiro Tsukamoto 1, Takahisa Jitsuno1, Takunori Taira 2
1Osaka Univ., Japan,
2Inst. material Science, Japan
13:45 14:15 SLPC5j-1Invited Ab-initio large-scale simulation for initial stage of laser damage in transparent nano-materials Kazuhiro Yabana1, Mitsuharu Uemoto1, Shunsuke A. Sato2, Yuta Hirokawa3, Taisuke Boku1
1Center for Computational Sciences, University of Tsukuba, Japan,
2Max Planck Institute for the Structure and Dynamics of Matter, Germany,
3Graduate School of Systems and Information Engineering, University of Tsukuba, Japan
We calculate energy transfer from femtosecond laser pulse to 3D nano-materials solving Maxwell equations for light electromagnetic fields and ab-initio time-dependent Kohn-Sham equation for quantum electron dynamics simultaneously.
14:15 14:45 SLPC5j-2Invited High throughput surface texturing of embossing rollers with fs-laser and polygon line scanner in fully synchronized mode Beat Jaeggi1, 2, Adrian Stirnimann1, Guido Hennig3, Beat Neuenschwander1
1Institute for Applied Laser, Photoncis and Surface technolpogies ALPS, Bern University of Applied Sciences, Switzerland,
2LASEA Switzerland, Switzerland,
3Daetwyler-Graephics AG, Switzerland
The combination of a polygon line scanner with a rotating roller, fully synchronized to a new high power fs laser, allows laser micromachining with highest precision and high throughput. We will present actual results from the European APPOLO Project.
14:45 15:15 PLDj-1Invited Mechanisims of laser damage in optical components for PW-class laser systems Stavros G Demos, Alexei A Kozlov, Kyle Kafka, James B Oliver, Semyon Papernov, Brittany Hoffman, Terrance J Kessler, Sheryl M Gracewski, John C Lambropoulos
University of Rochester, USA
We investigate the mechanisms of laser-induced damage and ensuing material modifications on multilayer dielectric mirrors and gratings. Thermomechanical modeling combined with analysis of damage morphologies provides insight into the energy deposition and relaxation pathways.
15:15 15:45 Break

Joint Session: LIC+PLD+SLPC Joint Session 2
Chair: Takahisa Jitsuno(Osaka University, Japan)

Room 302

Start End Session No. Title Speaker Description
15:45 16:15 PLDj-2Invited UV-induced aging leading to laser damage in the bulk of fused silica Frank R Wagner, Alexandre Beaudier, Jean-Yves Natoli
Aix Marseille Univ, CNRS, Centrale Marseille, Institut Fresnel, France
Results on material modifications observed by photoluminescence in the bulk of fused silica during UV S-on-1 tests show modifications in the color center concentrations before the occurrence of damage and help predicting fatigue damage.
16:15 16:45 LICj-1Invited Ultrafast laser direct writing of periodic nanostructure in bulk semiconductor crystals Yasuhiko Shimotsuma
Department of Material Chemistry, Graduate School of Engineering, Kyoto University, Japan
Self-assembled periodic nanostructures in bulk semiconductor crystals are photoinduced by ultrafast laser pulses. The formation mechanism of these nanostructures in bulk semiconductor crystal could be influenced by the transition type and the bandgap energy. Particularly, the electronic stress induced by the deformation potential of electronic states is considered to be one of important key for nanostructure formation.
16:45 17:15 LICj-2Invited One-shot 3D giant-pulse micro-laser processing by LCOS direct control Yasuki Sakurai1, 2, Yuji Hotta1, Ryohei Otowa1, Masashi Nishitateno1, Lihe Zheng2, Hiroshi Yamamoto2, Takunori Taira2
1Santec corporation, Japan,
2Institute of molecular science, Japan
We propose the one-shot 3D material processing with spatially modulated giant-pulse micro-laser output by LCOS direct control. The fine structured organic semiconductor film has been fabricated by MW-class 532nm beam exposer.
17:15 17:20 Closing of Joint Session
April 26 Thu.

SLPC7: Micro Nano Processing
Chairs: Andreas Ostendorf(Ruhr-University Bochum, Germany)
Masaki Hashida(Kyoto University, Japan)

Room 414+417

Start End Session No. Title Speaker Description
9:00 9:15 SLPC7-1 Laser fluence and time-interval dependences of ablation suppression for titanium by double-pulse femtosecond laser irradiation Yuki Furukawa1, 2, Sadaoki Kojima1, Kensuke Teramoto1, 2, Shunsuke Inoue1, 2, Masaki Hashida1, 2, Shuji Sakabe1, 2
1Advanced Research Center for beam Science, Institute for Chemical Research, Kyoto University, Japan,
2Graduate School of Science, Kyoto University, Japan
Double-pulse femtosecond laser pulses are irradiated on a titanium plate for various combinations of fluence. The depths of laser-produced craters are measured. The ablation suppression is observed by choosing appropriate fluence and time interval combination.
9:15 9:30 SLPC7-2 Deep drilling of metals with ultra-short laser pulses Daniel Johannes Förster, Daniel Holder, Thomas Arnold, Rudolf Weber, Thomas Graf
Institut für Strahlwerkzeuge IFSW, University of Stuttgart, Germany
A simplified model of the percussion drilling process to predict the achievable drilling depth was derived and systematically investigated. Based on this, a hole with a drilling depth of 10 mm could be achieved.
9:30 9:45 SLPC7-3 Formation of microstructures on Ni film surface by nanosecond laser irradiation Kazuki Koda1, Wataru Kobayashi2, Hiro Imai2, Masahiro Tsukamoto3
1Department of Mechanical Engineering, Osaka University, Japan,
2DENSO CORPORATION, Japan,
3Joining and Welding Research Institute, Osaka University, Japan
The formation of microstructures on a Ni film surface by nanosecond laser irradiation was investigated. The microstructures were formed by the interaction between the laser-induced plume and the film surface.
9:45 10:00 SLPC7-4 Two-dimensional amorphous transitional metal oxides from laser ablation in liquids for photocatalytic hydrogen production Z.Y. Lin, W.J. Li, G.W. Yang
School of Materials Science & Engineering, Sun Yat-sen University, China
Two-dimensional amorphous transitional metal oxides from laser ablation in liquids for photocatalytic hydrogen production
10:00 10:30 Break

SLPCp8: Poster Session
Chairs: Yuji Sato, Shin-Ichiro Masuno(JWRI, Osaka University, Japan)

Exhibition Hall A

Start End Session No. Title Speaker Description
10:30 12:00 SLPCp8-1 Investigate of the laser cladding process by blue diode laser Ritsuko Higashino1, Masahiro Tsukamoto1, Yuji Sato1, Nobuyuki Abe1, Kohei Asano1, Takahisa Shobu2, Yoshinori Funada3
1Joining and Welding Research Institute, Osaka University, Japan,
2Japan Atomic Energy Agency, Japan,
3Industrial Research Institute of Ishikawa, Japan
In order to clarify the mechanism of copper layer formation, the layer formation process when forming a copper layer using a blue direct diode laser was observed using in situ X ray observation technique.
SLPCp8-2 Pure copper layer formation on stainless steel plate with blue diode laser induced coating system Takahiro Hara1, Masahiro Tsukamoto2, Kohei Asano1, Yuji Sato2, Ritsuko Higashino2, Yoshinori Funada3, Nobuyuki Abe2
1Graduate School of Engineering, Osaka University, Japan,
2Joining and Welding Research Institute, Osaka University, Japan,
3Industrial Research Institute of Ishikawa, Japan
The pure copper layer was formed on the stainless steel plate with blue direct diode laser induced coating system in order to clarify the coating mechanism.
SLPCp8-3 Simple estimation method to calculate absorbed power distribution for selective laser melting Tomomasa Ohkubo1, Yuji Sato2, Toshi-Taka Ikeshoji3, Ei-ichi Matsunaga1, Masahiro Tsukamoto2
1Department of Mechanical Engineering, Tokyo University of Technology, Japan,
2Joining and Welding Research Institute, Osaka University, Japan,
3Fundamental Technology for Next Generation Research Institute, Kindai University, Japan
We propose a simple estimation model to calculate absorbed power distribution including depth direction using ray-tracing. A surrounding box which has cyclic boundaries enable to reduce the calculation cost.
SLPCp8-4 Selective laser melting of NdFeB magnetic powers Chung-Yo Chen1, Chung-Wei Cheng1, Mi-Ching Tsai2, Tsung-Wei Chang2, Wen-Cheng Chang3, An-Chen Lee1
1Department of Mechanical Engineering, National Chiao Tung University, Taiwan,
2Department of Mechanical Engineering, National Cheng Kung University, Taiwan,
3Department of Physics, National Chung Cheng University, Taiwan
This study utilized a self-developed multi-beams SLM system to fabricate NdFeB structures from Nd2Fe14B powders. The advantages are that the distance between the multi-beams, pulse duration, repetition rate, and scanning strategy can all be controlled.
SLPCp8-5 Bead-on welding of copper film using 100W blue diode laser Kento Morimoto1, Masahiro Tsukamoto2, Shin-ichiro Masuno2, Yuji Sato2, Kazuyuki Azumi1, Yoshihiko Hayashi1, 2, Nobuyuki Abe2
1Osaka Fuji Corporation, Japan,
2Joining and Welding Research Institute , Osaka University, Japan
Bead-on welding for the pure copper film was carried out using a blue diode laser. The bead was formed on the pure copper film without pore and crack by using the blue diode laser.
SLPCp8-6 Influence of intensity distribution on surface quality in high speed laser welding of aluminum alloy Martin Ruthandi Maina1, Yasuhiro Okamoto1, Akira Okada1, Matti Närhi2, Jarno Kangastupa2, Jorma Vihinen3
1Nontraditional Machining Laboratory, Okayama University, Japan,
2Corelase Oy, Finland,
3Laser Application Laboratory, Tampere University of Technology, Finland
Experimental and numerical investigations were performed in high speed laser welding of aluminium alloy. In order to achieve deep penetration with stable welding phenomena and ensure good surface quality, adjustable ring-mode fiber laser was used.
SLPCp8-7 Experimental characterization of the interaction dynamics of cw-laser radiation with metal samples in the 105W/cm² regime Dominic Heunoske, Sebastian Schäffer, Marcel Goesmann, Jens Osterholz, Mathias Wickert
Laser technologies, Fraunhofer EMI, Germany
At Laser intensities above 105kW/cm² material evaporates and affects the energy transfer from laser to metal sample. A systematic experimental study was performed using high-speed cameras, time- and space- resolved emission spectroscopy and interferometry
SLPCp8-8 Laser metal bumping with SUS316L molten powder jet by blue diode laser for steel / carbon fiber reinforced thermoplastics joint Kiyokazu Yasuda1, Yuki Uchida1, Rennosuke Tamura1, Takahiro Hara2, Yuji Sato2, Masahiro Tukamoto2
1Division of Materials and Manufacturing Science, Osaka University, Japan,
2Joining and Welding Research Institute, Osaka University, Japan
Laser Metal Bumping (LMB) was conducted with multi-fiber focused blue LD lasers. The surface morphology on mild steels by LMB turned to be from bead-like to isolated bump type, effective for strengthening steel /CFRTP joints.
SLPCp8-9 Effect of laser peening on aluminum alloy 7075 Ryotaro Oka1, Shin Toyokura1, Manabu Heya2, Miho Tsuyama1, Hitoshi Nakano1
1Department of Electrical and Electronic Engineering, Faculty of Science and Technology, Kindai University, Japan,
2Department of Electronic Information and Communication Engineering, Faculty of Engineering, Osaka-Sangyo University, Japan
This study is to clarify various characteristics when laser peeening treatment is performed on aluminum alloy 7075 which is usually used for aircraft parts.
SLPCp8-10 Control of plasma confinement layer for improving laser peening effect Akihiro Hata1, Naoya Ehara1, Manabu Heya2, Miho Tsuyama1, Hitoshi Nakano1
1Electrical and Electronic Engineering, Faculty of Science and Technology, Kindai University, Japan,
2Electronic information and Communication Engineering, Faculty of Engineering, Osaka-Sangyo University, Japan
Water which has high acoustic impedance and high laser transmittance is chosen as the plasma confinement layer. In this study, the water temperature is varied to improve the laser peening effect.
SLPCp8-11 Effect of control of acoustic impedance in plasma confinement layer on laser peening Miho Tsuyama1, Naoya Ehara1, Kazuma Yamashita1, Manabu Heya2, Hitoshi Nakano1
1Faculty of Science and Engineering, Kindai University, Japan,
2Faculty of Engineering, Osaka-sangyo University, Japan
The present study aimed to control the plasma confinement layer on laser peening. The plasma confinement layer contributes to the increase in the shock wave pressure by suppressing the expansion of the laser-produced plasma.
SLPCp8-14 Formation behavior of laser induced periodic surface structures in various media Tomoki Kobayashi1, Tomohiro Wakabayashi2, Yuichi Takushima3, Jiwang Yan1
1Mechanical Engineering, Keio University, Japan,
2Yazaki corporation, Japan,
3Optoquest, Japan
Laser-induced periodic surface structure (LIPSS) was formed on the stainless tool steel by irradiating a picosecond pulsed laser in various types of media. Different surface morphologies were observed on the material surface, depending on the types of media.
SLPCp8-15 Analytical approach to hydrophobic properties of micro patterns carbonized by 355nm UV laser Gyeongju Je1, Bosung Shin1, 2, Hyesu Kim1, Junhan Park1
1Cogno‑Mechatronics Engineering, Pusan National University, Korea of republic,
2Optics & Mechatronics Engineering, Pusan National University, Korea of republic
Carbonized patterning using 355nm UV laser was conducted to impart hydrophobicity on polyimide film and analyzed contact angle according to the properties of patterns.
SLPCp8-16 Femtosecond laser coloration with nanoparticles formed on titanium plate Shogo Nishino1, 2, Masaki Hashida1, 2, Hitoshi Sakagami3, Yuki Furukawa1, 2, Sadaoki Kojima2, Shunsuke Inoue1, 2, Shuji Sakabe1, 2
1Graduate School of Science, Kyoto University, Japan,
2Advanced Research Center for Beam Science, Institute for Chemical Research, Kyoto University, Japan,
3National Institute for Fusion Science, Japan
Coloration on titanium surface by femtosecond laser pluses is demonstrated and the correlation of color and formed nanoparticles on the surface is discussed. It has been found that color depends on particle size distribution.
SLPCp8-17 Volumetric graphics of microbubbles in gold nanoparticle-dispersed glycerin using femtosecond laser pulses Taisei Chiba, Kota Kumagai, Yoshio Hayasaki
Center for Optical Research and Education (CORE), Utsunomiya University, Japan
We have demonstrated the generation of femtosecond laser-induced microbubbles in glycerin containing gold nanoparticles. Gold nanoparticles reduced the energy for the generation of microbubbles and the expansion of the generation region in the axial direction.
SLPCp8-18 Micro and nano structured membranes for the use in AlGaN/GaN- MEMS and pressure sensors, microfluidic applications and bioengineering Johann Karl Zehetner1, Stephan Kasemann1, Gabriel Vanko2, Jaroslav Dzuba2, Tibor Lalinsky2, Sylvia Nürnberger3
1Research Centre for Microtechnology, University of Applied Sciences, Austria,
2Institute of Electrical Engineering, Slovak Academy of Sciences, Slovak Republic,
3Department of Trauma Surgery, Medical University of Vienna, Austria
By polarization determined femtosecond laser ablation combined with reactive ion etching we fabricated membranes in Si and SiC for pressure sensors and 300µm long needles on top of 10µm thick membranes for biomimetic microfluidic systems
SLPCp8-20 Three-dimensional Cu-based microfabrication using femtosecond laser induced internal writing Mizue Mizoshiri, Yukinari Kondo, Seiichi Hata
Graduate School of Engineering, Nagoya University, Japan
Three-dimensional Cu-based microstructures were fabricated using femtosecond laser induced internal writing. Localized plasmon enhancement and heat accumulation were selectively used to sinter single and multi-layers of Cu2O NSs.
SLPCp8-22 Ablation by double pulse irradiation by femtosecond laser with different delay time Masahito Katto1, Kensuke Nakajima2, Sho Kuronita2, Masahiro Tsukamoto3, Masanori Kaku2, Atsushi Yokotani2
1CRCC, University of Miyazaki, Japan,
2Faculty of Engineering, University of Miyazaki, Japan,
3JWRI, Osaka University, Japan
We examined the ablation traces on the Si surface irradiated by the double pulses of fs-laser. In the near threshold range, energy deposition by 1st pulse was affected the 2nd pulse until the 250 ps. Above the threshold the HAZ did not grown after the time interval of 50 ns. These results were explained by the energy transfer from electrons to lattice and thermal diffusion.
SLPCp8-23 Holographic laser processing using femtosecond second harmonic generation Ryo Onoda, Satoshi Hasegawa, Yoshio Hayasaki
Center for Optical Research and Education (CORE), Utsunomiya University, Japan
In order to perform efficient fabrication of diffractive optical elements based on refractive index modification inside a transparent material, holographic laser processing using femtosecond second-order harmonic generation was demonstrated. 
SLPCp8-24 Holographic complex-amplitude modulation for generating sub-diffraction-limit spot applied to laser material processing Satoshi Hasegawa1, Cao Hoai Vu1, Yusuke Ogura2, Jun Tanida2, Yoshio Hayasaki1
1Center for Optical Research and Education (CORE), Utsunomiya University, Japan,
2Graduate School of Information Science and Technology, Osaka University, Japan
We demonstrated the holographic complex-amplitude modulation for generating the sub-diffraction-limit spot applied to laser processing. The modulation is based on the regulation of the intensity and phase between the center and surrounding beams. In the presentation, a result of femtosecond laser processing using the sub-diffraction-limit spot will also be discussed.
SLPCp8-25 Direct-writing properties of Cu-Ni-based thermoelectric micropatterns formed by femtosecond laser reductive sintering at low writing speed Kenta Nishitani, Seiichi Hata, Junpei Sakurai, Mizue Mizoshiri
Department of micro-nano mechanical science and engineering, Graduate School of Engineering, Nagoya University, Japan
P-type Cu-Ni and n-type Cu2O thermoelectric micropatterns were selectively fabricated by femtosecond laser reductive sintering of CuO/NiO mixed nanoparticles. These micropatterns were formed at low writing speed without damage created by stage acceleration.
SLPCp8-26 The study of multi-angle drilling by Nd: YAG nanosecond laser on 27G needle and electrochemical polishing Hsin Hao Su1, Wei Te Wu1, Chien Hsing Chen2, Jian Neng Wang3
1Department of Biomechatronics Engineering, National Pingtung University of Science and Technology, Taiwan,
2Department of Physics, National Chung Cheng University, Taiwan,
3Department of Civil and Construction Engineering, National Yunlin University of Science and Technology, Taiwan
In this study, a series of multi-angle holes were drilled in the 27G dental irrigation needle. We used a nano-second pulsed laser source. Therefore, we used electrochemical polishing technology to improve the HAZ situation.
SLPCp8-27 Characterization a poly-silicon thin film formed by the laser annealing with a high-power blue laser diode Young-Hwan Choi, Hyun Yeol Ryu, Han-Youl Ryu
Physics, Inha University, Korea
We report on the crystallization of a-Si thin film by the annealing with a high-power blue laser diode, and the crystallinity of the annealed poly-Si was characterized by XRD, ellipsometry, and Raman measurements.
SLPCp8-28 Piercing of PTFE sheet by short pulse CO2 laser Hayato Goto1, Yuta Ishikawa1, Kazuyuki Uno1, Takahisa Jitsuno2
1University of Yamanashi, Japan,
2Institute of Laser Engineering, Osaka University, Japan
We pierced PTFE by a short pulse CO2 laser. The short laser pulse with the pulse tail with the fluence of about 7.5 J/cm2 produced a through hole.
SLPCp8-29 Characterization of two-photon laser exposure patterns in photoresist via photoluminescence quenching Edy Yulianto, Subhashri Chatterjee, Vygantas Mizeikis
Research Institute of Electronics, Shizuoka University, Japan
We report on imaging of latent 3D photo exposure patterns in photoresist exposed via two-photon absorption prior to their development. This technique can be used to reveal useful features of photo exposure, such as spatial distribution, laser modification threshold etc.
SLPCp8-30 Post-fabrication spectral tuning of perfect-absorber metasurface structures fabricated by direct laser write technique Subhashri Chatterjee1, Edy Yulianto1, Ihar Faniayeu1, 2, Vygantas Mizeikis1
1Research Institute of Electronics, Shizuoka University, Japan,
2Department of General Physics, Gomel State University, Belarus
We investigate posibilites to tune resonance wavelength of perfect absorber structures fabricated by Direct Laser Write (DLW) technique by varying thickness of the metallic film deposited conformally on the structures.
SLPCp8-32 Laser micro incising to wood surface – Perforations enable penetration of chemicals for wood modification – Satoshi Fukuta1, Masaki Nomura1, Koji Wakabayashi2
1Industrial Research Center, Aichi Center for Industry and Science Technology, Japan,
2Laser Technical Center, Laserx Co., Ltd., Japan
We proposed “Laser Micro Incising” for wood, a new technique applying short pulse laser. The perforations on wood surface processed by the laser enabled permeation of chemicals, and chemical modification of wood could be performed.
SLPCp8-33 Measurement and analysis of material properties using laser induced breakdown spectroscopy Sangwoo Yoon, Jihoon Kim, Joohan Kim
Department of Mechanical Engineering, Seoul National University of Science and Technology, Korea
LIBS is generally used to measure elemental distribution, but the plasma signal from the ablation of the material has a lot of information about the material and can analyze spectroscopic signals to confirm the various properties of the specimen.
12:00 13:30 Lunch

SLPC9: Cutting and Welding
Chairs: Yasuhiro Okamoto(Okayama University, Japan)
Takahiro Nakamura(Tohoku University, Japan)

Room 414+417

Start End Session No. Title Speaker Description
13:30 14:00 SLPC9-1Invited Sensors in laser materials processing: Are they finally ready to take the lead? Ruediger Moser1, Matthias Strebel1, Tobias Beck2, Stephan André2, Martin Schoenleber2, Markus Kogel-Hollacher1
1R&D, Precitec GmbH & Co. KG, Gaggenau, Germany,
2R&D, Precitec Optronik GmbH, Neu-Isenburg, Germany
This contribution to the SLPC conference will report on industrial solutions for laser processing implemented in a production line which support the Industry 4.0 aspects of flexible manufacturing, condition monitoring and smart maintenance to reduce machine downtime and facilitate self optimisation. 
14:00 14:15 SLPC9-2 High-quality high-speed welding of aluminum with 16 kW average laser power Christian Hagenlocher, Florian Fetzer, Rudolf Weber, Thomas Graf
Institut fuer Strahlwerkzeuge, University of Stuttgart, Germany
High laser powers enable welding of aluminum alloys with very high feed rates. X-ray videos show a constant capillary without any fluctuations. The resulting weld is free of pores and shows a constant penetration depth.
14:15 14:30 SLPC9-3 High power fiber laser welding of aerospace alloys with filler wire Mohammed Naeem
Engineering/ Application, Prima Power Laserdyne, USA
Work has been carried at Prima Power Laserdyne to develop laser and processing parameters to produce welds with nickel and titanium aerospace alloys to produce good quality welds that meet the stringent requirements of the aerospace industry.
14:30 14:45 SLPC9-4 Latest laser welding technology – Potentials for difficult to weld steel grades Matthias Beranek
TRUMPF Laser- und Systemtechnik GmbH, Germany
With ‘Modulated Laserwelding’ TRUMPF is introducing a novel solid state laser technology to solve the problems and challenges in laserwelding of high strength steel grades opening up a whole new set of possibilities for parts designs and usecases.
14:45 15:00 SLPC9-5 High aspect ratio laser cutting of CFRP using nanosecond UV laser pulses Masahiro Moriyama1, 7, Akira Mizutani2, Shuntaro Tani4, Ryosuke Nakamura2, Atsushi Kosuge4, Isao Ito4, Zhigang Zhao4, Takashi Hira1, Yohei Kobayashi4, 6, Hiroharu Tamaru1, 6, Norikatsu Mio3, 6, Makoto Kuwata-Gonokami5, Junji Yumoto1, 6
1Institute for Photon Science and Technology, The University of Tokyo, Japan,
2Department of Applied Physics, The University of Tokyo, Japan,
3Photon Science Center, The University of Tokyo, Japan,
4Institute for Solid State Physics, The University of Tokyo, Japan,
5Department of Physics, The University of Tokyo, Japan,
6Research Institute for Photon Science and Laser Technology, The University of Tokyo, Japan,
7Toray Industries, Inc., Japan
Laser processing of CFRPs for aircraft using nanosecond UV laser pulses was studied. As a result of this study, high aspect ratio laser cutting of more than 80 on CFRPs was achieved.
15:00 15:30 Break

SLPC10: Blue Laser Development and Processing
Chairs: James Bovatsek(Spectra-physics, USA)
Masahiro Tsukamoto(JWRI, Osaka University, Japan)

Room 414+417

Start End Session No. Title Speaker Description
15:30 16:00 SLPC10-1Invited High power blue lasers development for copper material processing Jean-Michel Pelaprat, Matthew Finuf, Robert Fritz, Mark Zediker
NUBURU Inc, USA
We will report the recent development of high power blue laser, their performance and their advantages for material processing. We will further report recent application results of metal processing and in particular the bead on plate test results with a 150 Watt and a 500Watts Continuous Wave blue laser, for welding copper foils up to 1mm thick and dissimilar metals lap welding up to 250 µm.
16:00 16:30 SLPC10-2Invited High brightness blue direct diode laser for advanced materials processing K. Tojo1, N. Wakabayashi1, M. Yamada1, S. Uno1, N. Ishigaki1, T Hiroki1, J. Saikawa1, S. Masuno2, K. Asano3, K. Asuka4, N. Abe2, M. Tsukamoto2
1Device Dept., Shimadzu Corporation, Japan,
2Joining and Welding Research Institute, Osaka University, Japan,
3Yamazaki Mazak Corporation, Japan,
4Nichia Corporation, Japan
High-power, high-brightness fiber-coupled Blue Direct Diode Laser using new beam multiplexing technique to achieve 450-nm power intensity of 1.2MW/cm2 on the fiber facet for practical use of several kind of material processing will be presented.
16:30 16:45 SLPC10-3 Laser cladding of pure copper with blue and IR laser Kohei Asano1, 6, Masahiro Tsukamoto2, Yuji Sato2, Ritsuko Higashino2, Yoshihisa Sechi3, Takahiro Hara4, Masanori Sengoku5, Minoru Yoshida5
1Graduate School of Engineering, Osaka University, Japan,
2Joining and Welding Research Institute, Osaka University, Japan,
3ProductionTechnology Division, Kagoshima Prefectural Institute of Industrial Technology, Japan,
4School of Engineering, Osaka University, Japan,
5Graduate School of Science and Engineering, Kindai University, Japan,
6Yamazaki Mazak Corp., Japan
Laser cladding of pure copper was conducted by the laser cladding system with blue laser and that with IR laser on type 304 stainless steel plates. We investigated pure copper layers produced by both systems and indicated primacy of blue laser over IR laser.
16:45 SLPC 2018
Award Ceremony and
Closing Remark
PAGETOP